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FS10R12VT3 датащи(PDF) 2 Page - Infineon Technologies AG |
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FS10R12VT3 датащи(HTML) 2 Page - Infineon Technologies AG |
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2 / 7 page ![]() 2 TechnischeInformation/TechnicalInformation FS10R12VT3 IGBT-Module IGBT-modules preparedby:MB approvedby:IG dateofpublication:2013-10-03 revision:2.0 VorläufigeDaten PreliminaryData Diode,Wechselrichter/Diode,Inverter HöchstzulässigeWerte/MaximumRatedValues PeriodischeSpitzensperrspannung Repetitivepeakreversevoltage Tvj = 25°C VRRM 1200 V Dauergleichstrom ContinuousDCforwardcurrent IF 10 A PeriodischerSpitzenstrom Repetitivepeakforwardcurrent tP = 1 ms IFRM 20 A Grenzlastintegral I²t-value VR = 0 V, tP = 10 ms, Tvj = 125°C I²t 33,0 A²s CharakteristischeWerte/CharacteristicValues min. typ. max. Durchlassspannung Forwardvoltage IF = 10 A, VGE = 0 V IF = 10 A, VGE = 0 V VF 1,65 1,65 2,10 V V Tvj = 25°C Tvj = 125°C Rückstromspitze Peakreverserecoverycurrent IF = 10 A, - diF/dt = 650 A/µs (Tvj=125°C) VR = 600 V VGE = -15 V IRM 16,0 16,5 A A Tvj = 25°C Tvj = 125°C Sperrverzögerungsladung Recoveredcharge IF = 10 A, - diF/dt = 650 A/µs (Tvj=125°C) VR = 600 V VGE = -15 V Qr 1,20 2,00 µC µC Tvj = 25°C Tvj = 125°C AbschaltenergieproPuls Reverserecoveryenergy IF = 10 A, - diF/dt = 650 A/µs (Tvj=125°C) VR = 600 V VGE = -15 V Erec 0,38 0,68 mJ mJ Tvj = 25°C Tvj = 125°C Wärmewiderstand,ChipbisGehäuse Thermalresistance,junctiontocase proDiode/perdiode RthJC 2,25 2,50 K/W Wärmewiderstand,GehäusebisKühlkörper Thermalresistance,casetoheatsink proDiode/perdiode λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 0,70 K/W TemperaturimSchaltbetrieb Temperatureunderswitchingconditions Tvj op -40 125 °C Modul/Module Isolations-Prüfspannung Isolationtestvoltage RMS, f = 50 Hz, t = 1 min VISOL 2,5 kV InnereIsolation Internalisolation Basisisolierung(Schutzklasse1,EN61140) basicinsulation(class1,IEC61140) Al2O3 Kriechstrecke Creepagedistance Kontakt-Kühlkörper/terminaltoheatsink Kontakt-Kontakt/terminaltoterminal 5,0 10,0 mm Luftstrecke Clearance Kontakt-Kühlkörper/terminaltoheatsink Kontakt-Kontakt/terminaltoterminal 3,2 7,0 mm VergleichszahlderKriechwegbildung Comperativetrackingindex CTI > 225 min. typ. max. Modulstreuinduktivität Strayinductancemodule LsCE 20 nH Modulleitungswiderstand,Anschlüsse- Chip Moduleleadresistance,terminals-chip TC=25°C,proSchalter/perswitch RCC'+EE' RAA'+CC' 9,00 9,00 m Ω Lagertemperatur Storagetemperature Tstg -40 125 °C Anpresskraft für mech. Bef. pro Feder mountig force per clamp F 30 - 50 N Gewicht Weight G 10 g With additional insulation of the mounting clamp higher values of creepage and clearance distances to the heatsink can be achieved. For more information call your responsible sales representative. |
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