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ams Datasheet

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[v1-02] 2017-Feb-27

AS7261N − Soldering & Storage Information

Manufacturing Process Considerations

The AS7261N package is compatible with standard reflow

no-clean and cleaning processes including aqueous, solvent or

ultrasonic techniques. However, as an open-aperture device,

precautions must be taken to avoid particulate or solvent

contamination as a result of any manufacturing processes,

including pick and place, reflow, cleaning, integration assembly

and/or testing. Temporary covering of the aperture is allowed.

To avoid degradation of accuracy or performance in the end

product, care should be taken that any temporary covering and

associated sealants/debris are thoroughly removed prior to any

optical testing or final packaging.

Storage Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of

absorbed moisture possible, each device is baked prior to being

dry packed for shipping.

Devices are dry packed in a sealed aluminized envelope called

a moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 12 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 12 months

• Ambient Temperature: <40°C

• Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed

the 12 month shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

AS7261N датащи(PDF) 34 Page - ams AG