 |
поискавой системы для электроныых деталей |
|
|
поискавой системы для электроныых деталей |
|
AS7261N датащи(PDF) 33 Page - ams AG |
|
|
|||||||||||||||||||||||||||||
AS7261N датащи(HTML) 33 Page - ams AG |
|
|
33 / 42 page  ams Datasheet Page 33 [v1-02] 2017-Feb-27 Document Feedback AS7261N − Soldering & Storage Information Soldering Information The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 41: Solder Reflow Profile Figure 42: Solder Reflow Profile Graph Parameter Reference Device Average temperature gradient in preheating 2.5 °C/s Soak time tSOAK 2 to 3 minutes Time above 217 °C(T1) t1 Max 60s Time above 230 °C(T2) t2 Max 50s Time above Tpeak - 10°C(T3) t3 Max 10s Peak temperature in reflow Tpeak 260 °C Temperature gradient in cooling Max -5 °C/s Soldering & Storage Information |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Russian ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
