Data Sheet

HMC8410

Rev. A | Page 17 of 17

OUTLINE DIMENSIONS

1.65

1.60

1.55

0.30

0.25

0.20

TOP VIEW

SIDE VIEW

0.35

0.30

0.25

BOTTOM VIEW

PIN 1 INDEX

AREA

0.90

0.85

0.80

1.05

1.00

0.95

0.203 REF

0.05 MAX

0.02 NOM

0.65 BSC

0.20

MIN

EXPOSED

PAD

2.05

2.00 SQ

1.95

4

6

1

3

COPLANARITY

0.08

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 41. 6-Lead Lead Frame Chip Scale Package [LFCSP],

2 mm × 2 mm Body and 0.85 mm Package Height

(CP-6-9)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Lead Finish

Package Description

Package Option

HMC8410LP2FE

−40°C to +85°C

MSL3

100% Matte Sn

6-Lead LFCSP

CP-6-9

HMC8410LP2FETR

−40°C to +85°C

MSL3

100% Matte Sn

6-Lead LFCSP

CP-6-9

EV1HMC8410LP2F

Evaluation PCB

1

The HMC8410LP2FE and HMC8410LP2FETR are RoHS Compliant Parts.

2

See the Absolute Maximum Ratings section for additional information.

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registered trademarks are the property of their respective owners.

D14657-0-11/17(A)