LT3089

25

3089f

For more information www.linear.com/LT3089

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/product/LT3089#packaging for the most recent package drawings.

4.00 ±0.10

(4 SIDES)

NOTE:

1. PACKAGE OUTLINE DOES NOT CONFORM TO JEDEC MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ±0.10

1

6

12

7

BOTTOM VIEW—EXPOSED PAD

2.65 ±0.10

0.75 ±0.05

R = 0.115

TYP

0.25 ±0.05

0.50 BSC

2.50 REF

3.38 ±0.10

0.200 REF

0.00 – 0.05

(DF12) DFN 1112 REV A

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.25 ±0.05

0.50 BSC

3.10 ±0.05

4.50 ±0.05

PACKAGE OUTLINE

PIN 1 NOTCH

R = 0.20 TYP OR

0.35

× 45°

CHAMFER

2.65 ±0.05

3.38 ±0.05

2.50 REF

DF Package

12-Lead Plastic DFN (4mm

× 4mm)

(Reference LTC DWG # 05-08-1733 Rev A)