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LTM4645 датащи(PDF) 21 Page - Linear Technology |
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LTM4645 датащи(HTML) 21 Page - Linear Technology |
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21 / 34 page ![]() LTM4646 21 4646f For more information www.linear.com/LTM4646 Figure 7. Diode Voltage VD vs Temperature T(°C) for Different Bias Currents VD T(KELVIN) • KD • ln ID IS where VD appears to increase with temperature. It is com- mon knowledge that a silicon diode biased with a current source has an approximate –2mV/°C temperature rela- tionship (Figure 7), which is at odds with the equation APPLICATIONS INFORMATION K’D = KD • In(10) = 198µV/k yields ∆VD = K’D • T(KELVIN) Solving for temperature: T(KELVIN) ∆VD K'D , T(KELVIN) [ C] 273.15, [ C] T(KELVIN) 273.15 means that if we take the difference in voltage across the diode measured at two currents with a ratio of 10, the result- ing voltage is 198V per Kelvin of the junction with a zero intercept at 0 Kelvin. The diode connected PNP transistor at the TEMP+, TEMP– pins can be used to monitor the internal temperature of the LTM4646. A general temperature moni- tor can be implemented by connecting a resistor between TEMP+ and VIN to set the current to 100µA, grounding the TEMP– pin, and then monitoring the diode voltage drop with temperature. A more accurate temperature monitor can be achieved with a circuit injecting two currents that are at a 10:1 ratio. See LTC2997 data sheet. Thermal Considerations and Output Current Derating The thermal resistances reported in the Pin Configuration section of the data sheet are consistent with those param- eters defined by JESD51-12 and are intended for use with finite element analysis (FEA) software modeling tools that leverage the outcome of thermal modeling, simulation, and correlation to hardware evaluation performed on a Module® package mounted to a hardware test board. The motivation for providing these thermal coefficients is found in JESD51-12 (“Guidelines for Reporting and Using Electronic Package Thermal Information”). Many designers may opt to use laboratory equipment and a test vehicle such as the demo board to anticipate the Module regulator’s thermal performance in their application at various electrical and environmental operating conditions to compliment any FEA activities. Without FEA software, the thermal resistances reported in the Pin Configuration section are in-and-of themselves not relevant to provid- ing guidance of thermal performance; instead, the derat- ing curves provided in the data sheet can be used in a 4646 F07 TEMPERATURE (°C) –173 –73 27 127 0.4 0.6 0.8 1.0 ∆VD ID = 100µA ID = 10µA term, increases with temperature, reducing the ln(ID/IS) absolute value yielding an approximate –2mV/°C com- posite diode voltage slope. To obtain a linear voltage proportional to temperature, we cancel the IS variable in the natural logarithm term to remove the IS dependency from the following equation. This is accomplished by measuring the diode voltage at two currents I1, and I2, where I1 = 10 • I2. Subtracting we get: ∆VD T(KELVIN) • KD •In I1 IS T(KELVIN) • KD •In I2 IS Combining like terms, then simplifying the natural log terms yields: ∆VD = T(KELVIN) • KD • In(10) and redefining constant |
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