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LTM4632

4632fc

For more information www.linear.com/LTM4632

APPLICATIONS INFORMATION

SAFETY CONSIDERATIONS

The LTM4632 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

LAYOUT CHECKLIST/EXAMPLE

The high integration of LTM4632 makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND, VOUT1 and VOUT2. It helps to mini-

mize the PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capac-

itors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce mod-

ule thermal stress, use multiple vias for interconnec-

tion between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

• For parallel modules, tie the VOUT, VFB, and COMP

pins together. Use an internal layer to closely con-

nect these pins together. The TRACK pin can be tied

a common capacitor for regulator soft-start.

• Bring out test points on the signal pins for monitoring.

Figure 18 gives a good example of the recommended

layout.

GND

COUT

CIN

VIN

Figure 18. Recommend PCB Layout

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