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LTM4630 датащи(PDF) 21 Page - Linear Technology |
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LTM4630 датащи(HTML) 21 Page - Linear Technology |
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21 / 34 page ![]() LTM4630 21 4630fa For more information www.linear.com/LTM4630 value is shown in the Pin Configuration section and should accurately equal the θJA value because approximately 100% of power loss flows from the junction through the board into ambient with no airflow or top mounted heat sink. Each system has its own thermal characteristics, therefore thermal analysis must be performed by the user in a particular system. The LTM4630 module has been designed to effectively remove heat from both the top and bottom of the pack- age. The bottom substrate material has very low thermal resistance to the printed circuit board. An external heat sink can be applied to the top of the device for excellent heat sinking with airflow. Figures 10 and 11 show temperature plots of the LTM4630 with no heat sink and 200LFM airflow. These plots equate to a paralleled 12V to 1.0V at 36A design operating at 84.5% efficiency, and 12V to 1.2V at 36A design operating at 86% efficiency. Safety Considerations The LTM4630 modules do not provide isolation from VIN to VOUT. There is no internal fuse. If required, a slow blow fuse with a rating twice the maximum input current needs to be provided to protect each unit from catastrophic failure. The device does support over current protection. A temperature diode is provided for monitoring internal temperature,andcanbeusedtodetecttheneedforthermal shutdown that can be done by controlling the RUN pin. APPLICATIONS INFORMATION Power Derating The 1.0V and 1.5V power loss curves in Figures 13 and 14 can be used in coordination with the load current derating curves in Figures 15 to 22 for calculating an approximate ΘJA thermal resistance for the LTM4630 with various heat sinking and airflow conditions. The power loss curves are taken at room temperature, and are increased with a 1.35 to 1.4 multiplicative factor at 125°C. These factors come from the fact that the power loss of the regulator increases about 45% from 25°C to 150°C, thus a 50% spread over 125°C delta equates to ~0.35%/°C loss increase. A 125°C maximumjunctionminus25°Croomtemperatureequates to a 100°C increase. This 100°C increase multiplied by 0.35%/°C equals a 35% power loss increase at the 125°C junction, thus the 1.35 multiplier. The derating curves are plotted with CH1 and CH2 in parallel single output operation starting at 36A of load with low ambient temperature. The output voltages are 1.0V and 1.5V. These are chosen to include the lower and higher output voltage ranges for correlating the thermal resistance. Thermal models are derived from several temperature measurements in a controlled temperature chamber along with thermal modeling analysis. Figure 10. Thermal Image 12V to 1.0V, 36A with 200LFM without Heat Sink Figure 11. Thermal Image 12V to 1.2V, 36A with 200LFM without Heat Sink |
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