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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LTC7130 датащи(PDF) 20 Page - Linear Technology |
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LTC7130 датащи(HTML) 20 Page - Linear Technology |
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20 / 36 page  LTC7130 20 7130fb For more information www.linear.com/LTC7130 Tables 1 and 2 provide heat sink and thermal conductive adhesive tape information. Table 1. Heat Sink Manufacturer (Thermally Conductive Adhesive Tape Pre-Attached) HEAT SINK MANUFACTURER PART NUMBER WEBSITE Cool Innovations 3-040404U www.coolinnovations.com Table 2. Thermally Conductive Adhesive Tape Vendor THERMALLY CONDUCTIVE ADHESIVE TAPE MANUFACTURER PART NUMBER WEBSITE Chomerics T411 www.chomerics.com Inductor Value Calculation Given the desired input and output voltages, the inductor value and operating frequency, fOSC, directly determine the inductor’s peak-to-peak ripple current: IRIPPLE = VOUT VIN VIN – VOUT fOSC •L ⎛ ⎝ ⎜ ⎞ ⎠ ⎟ Lower ripple current reduces core losses in the inductor, ESR losses in the output capacitors, and output voltage ripple. Thus, highest efficiency operation is obtained at low frequency with a small ripple current. Achieving this, however, requires a large inductor. It is recommended to choose a ripple current that is about 50% of IOUT(MAX). Note that the largest ripple current oc- curs at the highest input voltage. To guarantee that ripple currentdoesnotexceedaspecifiedmaximum,theinductor should be chosen according to: L ≈ VIN – VOUT fOSC •IRIPPLE • VOUT VIN Inductor Core Selection Once the inductance value is determined, the type of in- ductor must be selected. Core loss is independent of core size for a fixed inductor value, but it is very dependent on inductance selected. As inductance increases, core losses go down. Unfortunately, increased inductance requires moreturnsofwireandthereforecopperlosseswillincrease. Ferrite designs have very low core loss and are preferred at high switching frequencies, so design goals can con- centrate on copper loss and preventing saturation. Ferrite core material saturates “hard,” which means that induc- tance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate! CIN and COUT Selection Incontinuousmode,thesourcecurrentofthetopMOSFET is a square wave of duty cycle (VOUT)/(VIN). To prevent large voltage transients, a low ESR capacitor sized for the APPLICATIONS INFORMATION Figure 8. Temperature Derating Curve Based on the DC2341A Demo Board Figure 9. Temperature Derating Curve Based on the DC2341A Demo Board VOUT = 1.5V VIN = 12V fSW = 500kHz DC2341A DEMO BOARD WITH HEAT SINK 0LFM 200LFM 400LFM AMBIENT TEMPERATURE (°C) 0 25 50 75 100 125 0 5 10 15 20 25 Thermal Derating VIN = 12V 7130 F08 VOUT = 1.5V fSW = 500kHz DC2341A DEMO BOARD WITH HEAT SINK 0LFM 200LFM 400LFM AMBIENT TEMPERATURE (°C) 0 25 50 75 100 125 0 5 10 15 20 25 Thermal Derating VIN = 20V 7130 F09 VIN = 20V |
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