MP2321 datasheet(3/24 Pages) MPS

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MP2321 – 19V, 2A, LOW IQ, STEP-DOWN CONVERTER

PRELIMINARY SPECIFICATIONS SUBJECT TO CHANGE

MP2321 Rev. 1.0

www.MonolithicPower.com

10/26/2016

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS

(1)

VIN............................................................. +21V

VSW.................................... -0.3V (-5V < 10ns) to

VIN + 0.3V (23V < 10ns)

VBST ...................................................... VSW + 6V

All other pins .............................. -0.3V to +6V

(2)

Continuous power dissipation

(3)

QFN-14 (2mmx3mm)................................. 1.8W

Junction temperature ............................. +150°C

Lead temperature .................................. +260°C

Storage temperature................ -65°C to +150°C

Recommended Operating Conditions

(4)

Supply voltage (VIN)...........................4V to 19V

Output voltage (VOUT)........ 0.6V to VIN * DMAX

(5)

Operating junction temp. (TJ) ... -40°C to +125°C

Thermal Resistance (6)

θJA

θJC

QFN-14 (2mmx3mm)............. 70....... 15... °C/W

NOTES:

1) Exceeding these ratings may damage the device

2) For details on EN’s ABS max rating, please refer to the

Enable Control section on page 15.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) For details on DMAX, see the High Duty Cycle Condition

section on page 13.

6) Measured on JESD51-7, 4-layer PCB.

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