ACT2823

REV 1, 01-DEC-2016

is a trademark of Active-Semi.

4

PIN DESCRIPTIONS - QFN

PIN

NAME

DESCRIPTION

1

CSN

Output current sense negative input.

2,3

CSP

Output current sense positive input.

4, 5

VOUT

Power Output Pin.

6, 7

VIN

USB or AC Adapter input.

8

OVGATE

Output to drive optional external NMOS protect IC from over voltage.

9

OVSENS

USB or AC Adapter input sense pin.

10

SCL

I2C clock input.

11

SDA

I2C data input.

12

NC

Not connected. This pin must be floating. Do not connect this pin to any etch on the PCB.

13

HSB

High side bias pin used for high side FET gate drive. Connect a 47nF ceramic capacitor from HSB to SW.

14,15

SW

Internal switch connected to a terminal of the output inductor.

16,17

BAT

Charging output pin. Bypass to PGND with high quality ceramic capacitors placed as close to the IC as

possible. Connect to the charging current sense resistor.

18

BATS

Battery current sense positive input. Connect to CS resistor positive terminal with Kevin connection.

19

BATP

Battery current sense negative input. Connect to CS resistor negative terminal with Kevin connection.

20

NC

Not connected. This Pin must be floating. Do not connect this pin to any etch on the PCB.

21

PGND

Power ground.

22

BATN

Battery negative terminal. Connect directly to PGND.

23

ICST

Fast charge current setting pin. Connect a resistor from this pin to AGND to set the charging current. The

current setting ranges from 0.5A-1.5A. The voltage at this pin reflects the charge current and discharge

current in charge mode and discharge mode, respectively.

24

TH

Temperature sensing input. Connect to a battery thermistor terminal.

25

VREG

+5V Bias output. Connect a 1.0uF to this pin. This pin supplies up to 50mA output current. The bias turns on

in charge mode and discharge mode. Internal register bit can shut down the bias. Bias turns off in HZ mode.

26

AGND

Logic ground output. Connect this pin to the exposed PGND pad on same layer with IC.

27

PB

Push button input. When this pin is pushed for more than 40ms, LED1-4 indicators are enabled for 5

seconds.

28

LED1

Battery level indicator.

29

LED2

Battery level indicator.

30

LED3

Battery level indicator.

31

LED4

Battery level indicator.

32

LEDLS1

LED1 threshold level shift. Connect a resistor from the pin to AGND to shift LED1 threshold voltage.

33

LEDLS2

LED2 threshold level shift. Connect a resistor from the pin to AGND to shift LED2 threshold voltage.

34

LEDLS3

LED3 threshold level shift. Connect a resistor from the pin to AGND to shift LED3 threshold voltage.

35

LEDLS4

LED4 threshold level shift. Connect a resistor from the pin to AGND to shift LED4 threshold voltage.

36

PT

LED indication mode input. The 5 modes of LED indication patterns are set by a voltage at this pin. Connect

a resistor at the pin to set the voltage and an LED indication pattern.

37

RIMC

Battery impedance compensation input. Connect a resistor to this pin to offset the LED threshold voltages in

charge mode and discharge mode.

38

HYST

Hysteresis window setting input. Connect a resistor to ground to set LED1, 2, 3, 4 hysteresis windows.

39

DM

Output port auto detection input. Connected to portable device D-.

40

DP

Output port auto detection input. Connected to portable device D+.

Exposed Pad PGND

Electrically connected to AGND and PGND. Also used as thermal pad to remove heat from the IC. Connect

to the top layer ground plane and use recommended thermal vias to internal and back side PCB ground

planes.