NICHIA STS-DA1-4530B <Cat.No.170830>

35

RELIABILITY

(1) Tests and Results

Test

Reference

Standard

Test Conditions

Test

Duration

Failure

Criteria

#

Units

Failed/Tested

Resistance to

Soldering Heat

(Reflow Soldering)

JEITA ED-4701

300 301

Precondition: 30°C, 70%RH, 168hr

#1

0/22

Solderability

(Reflow Soldering)

JEITA ED-4701

303 303A

Lead-free Solder(Sn-3.0Ag-0.5Cu)

#2

0/22

Temperature Cycle

JEITA ED-4701

100 105

-40°C(30min)~25°C(5min)~

100°C(30min)~25°C(5min)

100cycles

#1

0/50

Moisture Resistance

(Cyclic)

JEITA ED-4701

200 203

25°C~65°C~-10°C, 90%RH,

24hr per cycle

10cycles

#1

0/22

High Temperature

Storage

JEITA ED-4701

200 201

1000hours

#1

0/22

Temperature Humidity

Storage

JEITA ED-4701

100 103

1000hours

#1

0/22

Low Temperature

Storage

JEITA ED-4701

200 202

1000hours

#1

0/22

Room Temperature

Operating Life

Condition 1

Test board: See NOTES below

1000hours

#1

0/22

Room Temperature

Operating Life

Condition 2

Test board: See NOTES below

500hours

#1

0/22

High Temperature

Operating Life

Test board: See NOTES below

1000hours

#1

0/22

Temperature Humidity

Operating Life

Test board: See NOTES below

500hours

#1

0/22

Low Temperature

Operating Life

Test board: See NOTES below

1000hours

#1

0/22

Vibration

JEITA ED-4701

400 403

4cycles, 4min, each X, Y, Z

48minutes

#1

0/22

Electrostatic Discharges

JEITA ED-4701

300 304

HBM, 2kV, 1.5kΩ, 100pF, 3pulses,

alternately positive or negative

#1

0/22

Soldering Joint Shear

Strength

JEITA ED-4702B

002 3

5N, 10±1sec

#1

0/22

NOTES:

1) Test board: Al board thickness=1.5mm, copper layer thickness=0.105mm, insulating layer thickness=0.12mm,

2) Measurements are performed after allowing the LEDs to return to room temperature.

(2) Failure Criteria

Criteria #

Items

Conditions

Failure Criteria

#1

>Initial value×1.1

<Initial value×0.7

#2

Solderability

-

Less than 95% solder coverage