NICHIA STS-DA1-4530B <Cat.No.170830>

11

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec

● Recommended Soldering Pad Pattern

● Recommended Solder Resist Opening

● Recommended Metal Solder Stencil Aperture

(単位 Unit: mm)

交差斜線部にランドパターンを配置しないでください。

Do not have the solder pads

in the area shaded with crossed diagonal lines.

5.9

6.7

7.15

0.8

0.3

1.45

0.95

1

2.03

2.65

Cathode

Anode

(9)

(2.1)

2.45

2.68

7.25

1.24

2.23

1.06

1.63

Cathode 1

Cathode 2

Anode

Cathode 1 and Cathode 2 should be soldered to a PCB.

* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered, Nichia cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.

* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or

atmosphere.

* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. Pressure can cause nicks,

chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.

When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress to the encapsulation of

the LEDs.

Recommended conditions:

It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)

* If the LEDs are picked and placed by a nozzle that does not comply with the recommended conditions,

it may cause the wires to break and the LED not to illuminate.

(単位 Unit: mm)

C0.23

4.8

5.6

R1

Φ

1