LP6253HSPF datasheet(9/12 Pages) POWER

9 / 12 page

LP6253H

Aug.-2017

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 9 of 12

Preliminary Datasheet

LP6253H

Output Capacitor Selection

For lower output voltage ripple, low-ESR ceramic

capacitors are recommended. The output capacitor

must be close to the VOUT and PGND pins. The

tantalum capacitors can be used as well, but the

ESR is bigger than ceramic capacitor. The output

voltage ripple consists of two components: one is the

pulsating output ripple current flows through the ESR,

and the other is the capacitive ripple caused by

charging and discharging. The major parameter

necessary to define the output capacitor is the

maximum allowed output voltage ripple of the

converter. This ripple is determined by two

parameters of the capacitor, the capacitance and the

ESR. It is possible to calculate the minimum

capacitance needed for the defined ripple, supposing

that the ESR is zero, by using Equation:

Layout Guideline

For high frequency switching power supplies, the

PCB layout is important step in system application

design. In order to let IC achieve good regulation,

high efficiency and stability, it is strongly

recommended the power components should be

placed as close as possible. The set races should be

wide and short. The feedback pin and then works of

feedback and compensation should keep away from

the power loops, and be shielded with a ground trace

or plane to prevent noise coupling.

Implementation of integrated circuits in low-profile

and fine-pitch surface-mount packages typically

requires special attention to power dissipation. Many

system-dependent issues such as thermal coupling,

airflow, added heat sinks and convection surfaces,

and the presence of other heat-generating

components affect the power-dissipation limits of a

given component. Three basic approaches for

enhancing thermal performance are listed below:

1. Improving the power dissipation capability of the

PCB design;

2. Improving the thermal coupling of the component

to the PCB;

3. Introducing airflow in the system.

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