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MCP6S21 датащи(PDF) 38 Page - Microchip Technology |
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MCP6S21 датащи(HTML) 38 Page - Microchip Technology |
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38 / 43 page ![]() MCP6S21/2/6/8 DS21117A-page 38 2003 Microchip Technology Inc. 16-Lead Plastic Small Outline (SL) – Narrow 150 mil (SOIC) Foot Angle φ 048 048 15 12 0 15 12 0 β Mold Draft Angle Bottom 15 12 0 15 12 0 α Mold Draft Angle Top 0.51 0.42 0.33 .020 .017 .013 B Lead Width 0.25 0.23 0.20 .010 .009 .008 c Lead Thickness 1.27 0.84 0.41 .050 .033 .016 L Foot Length 0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance 10.01 9.91 9.80 .394 .390 .386 D Overall Length 3.99 3.90 3.81 .157 .154 .150 E1 Molded Package Width 6.20 6.02 5.79 .244 .237 .228 E Overall Width 0.25 0.18 0.10 .010 .007 .004 A1 Standoff § 1.55 1.44 1.32 .061 .057 .052 A2 Molded Package Thickness 1.75 1.55 1.35 .069 .061 .053 A Overall Height 1.27 .050 p Pitch 16 16 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units α A2 E1 1 2 L h n B 45 ° E p D φ β c A1 A * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-108 § Significant Characteristic |
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