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LM2648 датащи(PDF) 17 Page - National Semiconductor (TI) |
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LM2648 датащи(HTML) 17 Page - National Semiconductor (TI) |
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17 / 23 page ![]() Operation Descriptions (Continued) Channel 3 Dual Phase Operation Channel 3 consists of two 180˚ out of phase converters operating in parallel to provide a single output voltage. In high current demand applications, current sharing between the two switching channels greatly reduces the stress and heat on the output stage components while lowering input ripple current. The sum of inductor ripple currents is also reduced which results in lowered output ripple voltage. When designing channel 3, simply design each switcher (3a and 3b) to supply half of the load current. Accurate current sensing is critical to ensure equal current sharing. Since each switcher has separate current sense and limit pins, channel 3 can also be operated in single phase mode. This requires that either channel 3a or 3b remains unused. To operate channel 3 as a single phase controller, make the following pin connections to the unused channel. Connect ILIM3x and KS3x to VIN, RSNS3x and SW3x to GND, leave HDRV3x and LDRV3x open, and connect CBOOT3X to VDD3X. SWITCHING NOISE REDUCTION Power MOSFETs are very fast switching devices. In syn- chronous rectifier converters, the rapid increase of drain current in the top FET coupled with parasitic inductance will generate unwanted Ldi/dt noise spikes at the source node of the FET (SWx node) and also at the VIN node. The magni- tude of this noise will increase as the output current in- creases. This parasitic spike noise may turn into electromag- netic interference (EMI), and can also cause problems in device performance. Therefore, it must be suppressed using one of the following methods. It is strongly recommended to add R-C filters to the current sense amplifier inputs of channel 3 as shown in Figure 2. This will reduce the susceptibility to switching noise, espe- cially during heavy load transients and short on-time condi- tions. The filter components should be connected as close as possible to the IC. As shown in Figure 3, adding a resistor in series with the SWx pin will slow down the gate drive (HDRVx), thus slowing the rise and fall time of the top FET, yielding a longer drain current transition time. Usually a 3.3 Ω to 4.7Ω resistor is sufficient to suppress the noise. Top FET switching losses will increase with higher resistance values. Small resistors (1-5 ohms) can also be placed in series with the HDRVx pin or the CBOOTx pin to effectively reduce switch node ringing. A CBOOT resistor will slow the rise time of the FET, whereas a resistor at HDRV will reduce both rise and fall times. OUTPUT VOLTAGE SETTING The output voltage for each channel is set by the ratio of a voltage divider as shown in Figure 4. The resistor values can be determined by the following equation: Although increasing the value of R1 and R2 will increase efficiency, this will also decrease accuracy. In the case of channels 1 and 2, increasing R2 will decrease loop gain, resulting in degraded transient response. The output voltage is limited by both maximum duty cycle and minimum on time. It is recommended that the nominal output voltage does not exceed 1V less than the minimum input voltage. In general, the minimum possible output voltage is approximately 1.3V. However, at maximum input voltage the minimum output will be determined by the minimum on time (166ns typ.) and may be as high as 1.35V for an input voltage of 18V. For input voltages below 5.5V, VLIN5 should be connected to VIN through a small resistor (approximately 4.7 Ω). This will ensure that VLIN5 does not fall below the UVLO thresh- old. LAYOUT RECOMMENDATIONS To ensure proper operation, a few key layout guidelines should be followed. The PGND and SGND pins and nodes should be connected to isolated ground planes which connect at a single point. This will help to keep the signal ground and thus the COMP and FB pins isolated from switching noise. All current sensing and limiting pins should be Kelvin con- nected directly to the current sense points. This will help ensure accurate current sensing and limiting. All FB voltage dividers should be placed close to the device, and the FB traces should be kept away from sources of noise. Input capacitors should be connected as close as possible to the top of the current sense resistors. Component Selection INPUT CAPACITOR SELECTION The fact that the switching channels of the LM2648 are 180˚ out of phase will reduce the RMS value of the ripple current seen by the input capacitors. This will help extend input capacitor life span and result in a more efficient system. Input capacitors must be selected that can handle both the maximum ripple RMS current at highest ambient tempera- 20059609 FIGURE 3. SW Series Resistor 20059611 FIGURE 4. Output Voltage Setting www.national.com 17 |
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