Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TLV2784CPWR

ACTIVE

TSSOP

PW

14

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2784ID

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2784IDR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2784IN

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPD

Level-NC-NC-NC

TLV2784IPW

ACTIVE

TSSOP

PW

14

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2784IPWR

ACTIVE

TSSOP

PW

14

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2785AID

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2785AIDR

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2785AIPW

ACTIVE

TSSOP

PW

16

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2785AIPWR

ACTIVE

TSSOP

PW

16

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2785CD

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2785CDR

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2785CPW

ACTIVE

TSSOP

PW

16

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2785CPWR

ACTIVE

TSSOP

PW

16

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2785ID

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2785IDR

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2785IN

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLV2785IPW

ACTIVE

TSSOP

PW

16

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLV2785IPWR

ACTIVE

TSSOP

PW

16

2000

None

CU NIPDAU

Level-1-220C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

PACKAGE OPTION ADDENDUM

www.ti.com

22-Feb-2005

Addendum-Page 3