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TLV2780CDBVT датащи(PDF) 16 Page - Texas Instruments

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номер детали TLV2780CDBVT
подробное описание детали  FAMILY OF 1.8V HIGH SPEED RAIL TO RAIL INPUT OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
PDF  32 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

TLV2780CDBVT датащи(HTML) 16 Page - Texas Instruments

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TLV2780, TLV2781, TLV2782, TLV2783, TLV2784, TLV2785, TLV278xA
FAMILY OF 1.8 V HIGHSPEED RAILTORAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS245E − MARCH 2000 − REVISED JANUARY 2005
16
WWW.TI.COM
APPLICATION INFORMATION
general power dissipation considerations
For a given
θJA, the maximum power dissipation is shown in Figure 34 and is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of TLV278x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)
1
0.75
0.5
0
−55 −40 −25 −10 5
1.25
1.5
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.75
20 35 50
0.25
TA − Free-Air Temperature − °C
2
65 80 95 110 125
MSOP Package
Low-K Test PCB
θJA = 260°C/W
TJ = 150°C
PDIP Package
Low-K Test PCB
θJA = 104°C/W
SOIC Package
Low-K Test PCB
θJA = 176°C/W
SOT-23 Package
Low-K Test PCB
θJA = 324°C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 34. Maximum Power Dissipation vs Free-Air Temperature



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