FDMF5821 datasheet(5/26 Pages) ONSEMI

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FDMF5821 • Rev. 1.0

Absolute Maximum Ratings

Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only. TA = TJ = 25°C

Symbol

Parameter

Min.

Max.

Unit

VCC

Supply Voltage

Referenced to AGND

-0.3

6.0

PVCC

Drive Voltage

Referenced to AGND

-0.3

6.0

VEN/FAULT#

Output Enable / Disable

Referenced to AGND

-0.3

6.0

VPWM

PWM Signal Input

Referenced to AGND

-0.3

6.0

VZCD#

ZCD Mode Input

Referenced to AGND

-0.3

6.0

VGL

Low Gate Manufacturing Test Pin

Referenced to AGND (DC only)

-0.3

6.0

Referenced to AGND, AC<20 nS

-3.0

6.0

VTMON

Thermal Monitor

Referenced to AGND

-0.3

6.0

VIN

Power Input

Referenced to PGND, AGND

-0.3

25.0

VPHASE

PHASE

Referenced to PGND, AGND (DC Only)

-0.3

25.0

Referenced to PGND, AC < 20 ns

-7.0

30.0

VSW

Switch Node Input

Referenced to PGND, AGND (DC Only)

-0.3

25.0

Referenced to PGND, AC < 20 ns

-7.0

30.0

VBOOT

Bootstrap Supply

Referenced to AGND (DC Only)

-0.3

30.0

Referenced to AGND, AC < 20 ns

-5.0

35.0

VBOOT-PHASE Boot to PHASE Voltage

Referenced to PVCC

-0.3

6.0

IO(AV)

(3)

Output Current

fSW = 300 kHz, VIN=12 V, VOUT=1.8 V

fSW = 1 MHz, VIN=12 V, VOUT=1.8 V

IFAULT

EN / FAULT# Sink Current

-0.1

7.0

θJ-A

Junction-to-Ambient Thermal Resistance

12.4

°C/W

θJ-PCB

Junction-to-PCB Thermal Resistance (under ON

’s SPS Thermal Board)

1.8

°C/W

Ambient Temperature Range

-40

+125

°C

Maximum Junction Temperature

+150

°C

TSTG

Storage Temperature Range

-55

+150

°C

ESD

Electrostatic Discharge

Protection

Human Body Model, ANSI/ESDA/JEDEC

JS-001-2012

3000

Charged Device Model, JESD22-C101

2500

Note:

IO(AV) is rated with testing ON’s SPS evaluation board at TA = 25°C with natural convection cooling. This rating is

limited by the peak SPS temperature, TJ = 150°C, and varies depending on operating conditions and PCB layout.

This rating may be changed with different application settings.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

Operating Conditions are specified to ensure optimal performance to the datasheet specifications. On does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Min.

Typ.

Max.

Unit

VCC

Control Circuit Supply Voltage

4.5

5.0

5.5

PVCC

Gate Drive Circuit Supply Voltage

4.5

5.0

5.5

VIN

Output Stage Supply Voltage

4.5

(4)

12.0

16.0

(5)

Operating Junction Temperature

-40

+125

°C

Notes:

3.0 V VIN is possible according to the application condition.

Operating at high VIN can create excessive AC voltage overshoots on the SW-to-GND and BOOT-to-GND nodes during

MOSFET switching transient. For reliable SPS operation, SW to GND and BOOT to GND must remain at or below the Absolute

Maximum Ratings in the table above.

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