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AD5590BBCZ датащи(PDF) 12 Page - Analog Devices |
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AD5590BBCZ датащи(HTML) 12 Page - Analog Devices |
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12 / 45 page ![]() AD5590 Rev. A | Page 11 of 44 ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise noted. VDD refers to DACVDD or ADCVDD. GND refers to DACGND or ADCGND. Table 7. Parameter Rating VDD to GND −0.3 V to +7 V VDRIVE to GND −0.3 V to VDD + 0.3 V Op Amp Supply Voltage 6 V Op Amp Input Voltage (V1− or V2−) − 0.3 V to (V1+ or V2+) + 0.3 V Op Amp Differential Input Voltage ±6 V Op Amp Output Short-Circuit Duration to GND Indefinite Analog Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Input Voltage to GND −0.3 V to +7 V Digital Output Voltage to GND −0.3 V to VDD +0.3 V VREFA to GND −0.3 V to VDD +0.3 V VREFIN/VREFOUT to GND −0.3 V to VDD +0.3 V Input Current to Any ADC Pin Except Supplies ±10 mA Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a 4-layer JEDEC thermal test board for surface- mount packages. Table 8. Thermal Resistance Package Type θJA Unit 80-Ball CSP_BGA 40 °C/W Table 9. Junction Temperature Parameter Max Unit Comments Junction Temperature1, 2 130 °C TJ = TA + PTOTAL × θJA 1 PTOTAL is the sum of ADC, DAC, and operational amplifier supply currents. 2 θJA is the package thermal resistance. ESD CAUTION |
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