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LM2753SD датащи(PDF) 7 Page - National Semiconductor (TI) |
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LM2753SD датащи(HTML) 7 Page - National Semiconductor (TI) |
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7 / 8 page ![]() Application Information (Continued) MULTI-LEVEL SWITCH ARRAY. In order to supply high load currents across the entire V IN operating range, especially at lower V IN, switches in the charge pump are normally designed to have low on- resistance. However at high input voltages and low load currents, this low resistance results in high output voltage ripple due to the output capacitor being charged too quickly. To solve this problem, while still being able to deliver the needed output current, the LM2753 has a switch array with multiple switches connected in parallel. The number of switches used in parallel depends on the input voltage applied to the LM2753. At lower input voltages all paralleled switches are used, and as the input voltage rises, switches are removed from the parallel configuration. The highest switch resistance is achieved as the input volt- age reaches the maximum operating voltage, which helps with voltage management. THERMAL PROTECTION When the junction temperature exceeds 140˚C (typ.), the LM2753 internal thermal protection circuitry disables the part. This feature protects the device from damage due to excessive power dissipation. The device will recover and operate normally when the junction temperature falls below 125˚C (typ.). It is important to have good thermal conduction with a proper layout to reduce thermal resistance. POWER EFFICIENCY Charge-Pump efficiency is derived in the following two ideal equations (supply current and other losses are neglected for simplicity): I IN =GxIOUT E=(V OUT xIOUT)÷(VIN xIIN)=VOUT ÷(GxVIN) In the equations, G represents the charge pump gain. Effi- ciency is at its highest asGxV IN approaches VOUT. Refer to the efficiency graph in the Typical Performance Character- istics section for the detailed efficiency data. POWER DISSIPATION The power dissipation (P DISSIPATION) and junction tempera- ture (T J) can be approximated with the equations below. PIN is the product of the input current and input voltage, P OUT is the power consumed by the load connected to the output, T Ais the ambient temperature, and θ JA is the junction-to- ambient thermal resistance for the LLP-10 package. V IN is the input voltage to the LM2753, V VOUT is the voltage at the output of the device, and I OUT is the total current supplied to the load(s) connected to both V OUT and IOUT. P DISSIPATION =PIN -POUT =(V IN xIOUT)−(VVOUT xIOUT) T J =TA +(PDISSIPATION x θ JA) The junction temperature rating takes precedence over the ambient temperature rating. The LM2753 may be operated outside the ambient temperature rating, so long as the junc- tion temperature of the device does not exceed the maxi- mum operating rating of 120˚C. The maximum ambient tem- perature rating must be derated in applications where high power dissipation and/or poor thermal resistance causes the junction temperature to exceed 120˚C. www.national.com 7 |
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