| производитель | номер детали | датащи | подробное описание детали |
 Amkor Technology |
MO-216
|
728Kb / 2P |
The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities
09/19 |
|
MO-219
|
728Kb / 2P |
The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities
09/19 |
 Vishay Siliconix |
MO-220
|
53Kb / 2P |
PowerPAK MLP44-16 (POWER IC ONLY)
16-May-05 |
 Broadcom Corporation. |
MO-220VGGC
|
596Kb / 12P |
Agilent HSDL-7002 IrDA® 3/16 Encode/Decode Integrated Circuit in QFN Package
|
 Pericom Semiconductor C... |
MO-229C
|
72Kb / 1P |
12-Contact, Thin Dual-in-line Flat No-Lead, TDFN
|