FEATURES
Package height down to 0.6 mm
Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices
Established package infrastructure with standard CABGA and fcCSP footprints
Consistent product performance with high yields and reliability
Die overhang wirebonding
Low loop wirebonding to 40 μm or less
Pb-free, RoHS compliant and green materials
Passive component integration options
JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298

Applications
FlipStack® CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.