PPGA датащи(PDF) - Amkor Technology

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PPGA датащи (PDF) - Amkor Technology

PPGA Datasheet PDF - Amkor Technology


номер детали	PPGA

скачать	PPGA скачать

объем файла	304.73 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали

Plastic Pin Grid Array Package

PPGA Datasheet (PDF)

Go To PDF Page

скачать датащи

PPGA Datasheet PDF - Amkor Technology


номер детали	PPGA

скачать	PPGA Click to download

объем файла	304.73 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Plastic Pin Grid Array Package

PPGA датащи (HTML) - Amkor Technology

PPGA Datasheet HTML 1Page - Amkor Technology

Аналогичный номер детали - PPGA

производитель	номер детали	датащи	подробное описание детали
Hammond Manufacturing L...	PPG	69Kb / 1P	Panneau de ventilation
Littelfuse	PPG	221Kb / 2P	PPG Series Thin Film Platinum RTDs February 1, 2018
SAB North America	PPG-11	176Kb / 1P	Polyamide 6 Cord Grips
	PPG-11R	176Kb / 1P	Polyamide 6 Cord Grips
	PPG-13	176Kb / 1P	Polyamide 6 Cord Grips

Аналогичное описание - PPGA

производитель	номер детали	датащи	подробное описание детали
Precid-Dip Durtal SA	510-93-108-12-051-001	33Kb / 1P	Pin grid array sockets Solder tail
Precid-Dip Durtal SA	612-93-108-12-051-001	53Kb / 1P	Pin grid array sockets Carrier types
National Semiconductor ...	U99A	65Kb / 1P	99 Pin Ceramic Pin Grid Array NS Package Number U99A
	MKT-U323A	59Kb / 1P	PIN GRID ARRAY CERAMIC, CAVITY DOWN, 323 PIN
	UP159A	70Kb / 1P	159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A
	U84C	71Kb / 1P	84 Pin Ceramic Pin Grid Array
	U120A	69Kb / 1P	120 Pin Ceramic Pin Grid Array
fujitsu semiconductor	BGA-320P-M06	34Kb / 1P	PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Amkor Technology	CLGA	357Kb / 1P	Ceramic Land Grid Array Package
Amkor Technology	CPGA	533Kb / 1P	Ceramic Pin Grid Array Package

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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