CLGA датащи(PDF) - Amkor Technology

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CLGA датащи (PDF) - Amkor Technology

CLGA Datasheet PDF - Amkor Technology


номер детали	CLGA

скачать	CLGA скачать

объем файла	357.67 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

Ceramic Land Grid Array Package

CLGA Datasheet (PDF)

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скачать датащи

CLGA Datasheet PDF - Amkor Technology


номер детали	CLGA

скачать	CLGA Click to download

объем файла	357.67 Kbytes

Page	1 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Ceramic Land Grid Array Package

CLGA датащи (HTML) - Amkor Technology

CLGA Datasheet HTML 1Page - Amkor Technology

Аналогичный номер детали - CLGA

производитель	номер детали	датащи	подробное описание детали
Mean Well Enterprises C...	CLG-100	218Kb / 2P	100W Single Output Switching Power Supply
	CLG-100	99Kb / 1P	30~60W Single Output with PFC
	CLG-100	247Kb / 3P	100W Single Output Switching Power Supply
	CLG-100	247Kb / 3P	100W Single Output Switching Power Supply
	CLG-100	250Kb / 3P	100W Single Output Switching Power Supply

Аналогичное описание - CLGA

производитель	номер детали	датащи	подробное описание детали
National Semiconductor ...	U99A	65Kb / 1P	99 Pin Ceramic Pin Grid Array NS Package Number U99A
STATS ChipPAC, Ltd.	FLGA	515Kb / 2P	Fine Pitch Land Grid Array
STATS ChipPAC, Ltd.	FLGA-SD	537Kb / 2P	Fine Pitch Land Grid Array - Stacked Die
National Semiconductor ...	U84C	71Kb / 1P	84 Pin Ceramic Pin Grid Array
National Semiconductor ...	U120A	69Kb / 1P	120 Pin Ceramic Pin Grid Array
fujitsu semiconductor	BGA-320P-M06	34Kb / 1P	PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Amkor Technology	CPGA	533Kb / 1P	Ceramic Pin Grid Array Package
Amkor Technology	PPGA	304Kb / 1P	Plastic Pin Grid Array Package
Maxim Integrated Produc...	90-0171	28Kb / 1P	PACKAGE LAND PATTERN, (U28) 4.4MM TSSOP Rev B
Maxim Integrated Produc...	90-0360	63Kb / 1P	PACKAGE LAND PATTERN, (G2044Y1) Rev A

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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