| производитель | номер детали | датащи | подробное описание детали |
 Amkor Technology |
WLCSP
|
474Kb/2P |
Wafer Level Processing and Die Processing Services
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WLCSP+
|
1Mb/5P |
Wafer level packaging applies similar processes as used in front-end wafer processing.
01/22 |
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WLCSP-V01
|
813Kb/3P |
Wafer Level Processing & Die Processing Services (WLP/DPS)
01/22 |
 Global Mixed-mode Techn... |
WLCSP11X12-132
|
165Kb/1P |
Package Outline
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WLCSP15X15-163
|
173Kb/1P |
Package Outline
|
 NXP Semiconductors |
WLCSP16
|
255Kb/38P |
32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM
Rev. 00.04-23 June 2010 |
 Global Mixed-mode Techn... |
WLCSP2X2-4
|
120Kb/1P |
Package Outline
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WLCSP2X3-5
|
115Kb/1P |
Package Outline
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WLCSP2X3-6
|
121Kb/1P |
Package Outline
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WLCSP2X4-8
|
121Kb/1P |
Package Outline
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WLCSP3X3-5
|
122Kb/1P |
Package Outline
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WLCSP3X3-9
|
120Kb/1P |
Package Outline
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WLCSP3X4-12
|
120Kb/1P |
Package Outline
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WLCSP4X2-8
|
117Kb/1P |
Package Outline
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WLCSP4X4-16
|
218Kb/1P |
Package Outline
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WLCSP4X5-20
|
240Kb/1P |
Package Outline
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WLCSP5X5-25
|
122Kb/1P |
Package Outline
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WLCSP6X5-30
|
183Kb/1P |
Package Outline
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WLCSP6X6-36
|
185Kb/1P |
Package Outline
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WLCSP6X7-42
|
178Kb/1P |
Package Outline
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