19

ATA6830

4575C–BCD–05/03

7

Timing

7.1

Baud rate

f

full synchronization

22

Baud

2350

2400

2450

Baud

C, D

7.2

Delay time

2 following

commands

22

5ms

C, D

7.3

Pause time

Between high and low

byte

22

T

P

0µs

C, D

7.4

Clamping time

Bus error clamping

22

Tcl

3

s

C, D

8Logic

8.1

Reference run

detection

Commands in series

to execute first

reference run

Ref3

333

cmd

(1)

D

8.2

Synchronization

15% oscillator

tolerance

Sync

4

cmd

(1)

D

9

Thermal Values

9.1

Thermal prewarning

T_150

150

°CB

9.2

Hysteresis

Thermal prewarning

T_150

HYS

10

°CB

9.3

Thermal shut down

T_160

160

°CB

9.5

Thermal current

boost

T_0

0

°CB

9.6

Hysteresis

Thermal currrent

boost

T_0_HYS

10

°CB

Electrical Characteristics (Continued)

No.

Parameters

Test Conditions

Pin

Symbol

Min.

Typ.

Max.

Unit

Type*

*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter

Note:

1. cmd = command

Soldering Recommendations

Parameters

Symbol

Value

Unit

Maximum heating rate

T

D

1 to 3

°C/s

Peak temperature in preheat zone

T

PH

100 to 140

°C

Duration of time above melting point of solder

t

MP

minimum 10

maximum 75

s

Peak reflow temperature

220 to 225

°C

Maximum cooling rate

2 to 4

°C/s