245

www .littelfuse .com

5

TVS Diode Arrays

SP723

Electronic Protection Array for ESD and Overvoltage Protection

Small Outline Plastic Packages (SOIC)

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

BS

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

C

H

µ

0.25(0.010)

B

M

M

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.0532

0.0688

1.35

1.75

-

A1

0.0040

0.0098

0.10

0.25

-

B

0.013

0.020

0.33

0.51

9

C

0.0075

0.0098

0.19

0.25

-

D

0.1890

0.1968

4.80

5.00

3

E

0.1497

0.1574

3.80

4.00

4

e

0.050 BSC

1.27 BSC

-

H

0.2284

0.2440

5.80

6.20

-

h

0.0099

0.0196

0.25

0.50

5

L

0.016

0.050

0.40

1.27

6

N8

8

7

-

µ