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TL3 датащи(PDF) 22 Page - Vishay Siliconix

номер детали TL3
подробное описание детали  Solid Tantalum Surface Mount Chip Capacitors, TANTAMOUNT™, Molded Case, Very Low DCL
PDF  23 Pages
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производитель  VISHAY [Vishay Siliconix]
домашняя страница  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TL3 датащи(HTML) 22 Page - Vishay Siliconix

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Typical Performance Characteristics
www.vishay.com
Vishay Sprague
Revision: 21-Jun-17
3
Document Number: 40192
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
POST TEST PERFORMANCE
Terminal strength /
shear force test
Apply a pressure load of 17.7 N for 60 s
horizontally to the center of capacitor side body.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Vibration
MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz, 20 g peak, 8 h, at rated voltage
Electrical measurements are not applicable, since the
same parts are used for shock (specified pulse) test.
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Shock
(specified pulse)
MIL-STD-202, method 213, condition I,
100 g peak
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance to
soldering heat
Recommended reflow profiles temperatures and
durations are located within the Capacitor Series
Guides
MIL-STD-202, method 210, condition B
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Solderability and
dissolution of metallization
MIL-STD-202, method 208, ANSI/J-STD-002, test
B (SnPb) and B1 (lead (Pb)-free). Dissolution of
metallization: method D.
Does not apply to gold terminations.
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.



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