CS8182

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12

PACKAGE DIMENSIONS

DPAK−5

DT SUFFIX

CASE 175AA−01

ISSUE A

D

A

K

B

R

V

S

F

L

G

5 PL

M

0.13 (0.005)

T

E

C

U

J

H

PLANE

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.235

0.245

5.97

6.22

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.020

0.028

0.51

0.71

E

0.018

0.023

0.46

0.58

F

0.024

0.032

0.61

0.81

G

0.180 BSC

4.56 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.102

0.114

2.60

2.89

L

0.045 BSC

1.14 BSC

R

0.170

0.190

4.32

4.83

S

0.025

0.040

0.63

1.01

U

0.020

−−−

0.51

−−−

V

0.035

0.050

0.89

1.27

Z

0.155

0.170

3.93

4.32

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

R1

0.185

0.210

4.70

5.33

R1

12 3 4 5

6.4

0.252

0.8

0.031

10.6

0.417

5.8

0.228

SCALE 4:1

mm

inches

0.34

0.013

5.36

0.217

2.2

0.086

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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CS8182/D

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