iC-DC

2-CHANNEL BUCK/BOOST DC/DC CONVERTER

Rev B1, Page 6/19

ABSOLUTE MAXIMUM RATINGS

Maximum ratings do not constitute permissible operating conditions; functionality is not guaranteed. Exceeding the maximum ratings can

damage the device.

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 V()

Voltage at VB

-38.5

42

V

G002 V()

Voltage at VBR, VBL, ENV1, ENV2

-0.3

42

V

G003 V()

Voltage at VHL, VH, VBROK, NAUT,

TOK, TEST

-0.3

8.4

V

G004 V()

Voltage at VH1, VH2

-0.3

6.4

V

G005 V()

Voltage at VCC1, VCC2, V1OK, V2OK,

CFG1, CFG2, POE1, POE2, RREF,

GNDA

-0.3

5.6

V

G006 I(VB)

Current in VB

-50

800

mA

G007 I(VBR)

Current in VBR

-50

800

mA

G008 I(VBL)

Current in VBL

-800

50

mA

G009 I(VHL)

Current in VHL

-50

800

mA

G010 I()

Current in VH, VH1, VH2, VCC1, VCC2

-500

20

mA

G011 I()

Current in CFG1, CFG2, ENV1, ENV2,

V1OK, V2OK, VBROK, NAUT, TOK,

POE1, POE2, RREF, TEST, GNDA

-20

20

mA

G012 Vd()

ESD Susceptibility at all pins

HBM, 100 pF discharged through 1.5 kΩ

2

kV

G013 Tj

Chip-Temperature

-40

150

°C

G014 Ts

Storage Temperature Range

-40

150

°C

THERMAL DATA

Operating conditions: VB = +4 V to +36 V

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01 Ta

Operating Ambient Temperature Range

-40

105

°C

T02 Rthja

Thermal Resistance Chip to Ambient

QFN24

Surface mounted, Thermal-Pad soldered to

30

40

K/W

All voltages are referenced to ground (pin GND: power ground) unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.