SN74LVC2G38

DUAL 2INPUT NAND GATE

WITH OPEN DRAIN OUTPUT

SCES554A − MARCH 2004 − REVISED OCTOBER 2004

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

This device is a dual two-input NAND buffer gate with open-drain outputs. It performs the Boolean function

Y = A

• B or Y = A + B in positive logic.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC2G38YEPR

_ _ _D7_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

Reel of 3000

SN74LVC2G38YZPR

_ _ _D7_

−40

°C to 85°C

SSOP − DCT

Reel of 3000

SN74LVC2G38DCTR

C38_ _ _

VSSOP − DCU

Reel of 3000

SN74LVC2G38DCUR

C38_

VSSOP − DCU

Reel of 250

SN74LVC2G38DCUT

C38_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2004, Texas Instruments Incorporated

DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1A

1B

2Y

GND

1Y

2B

2A

4

3

2

1

5

6

7

8

GND

2Y

1B

1A

2A

2B

1Y

YEP OR YZP PACKAGE

(BOTTOM VIEW)

NanoStar and NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.