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MPXM2102AS датащи(PDF) 278 Page - Motorola, Inc |
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MPXM2102AS датащи(HTML) 278 Page - Motorola, Inc |
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278 / 670 page ![]() MPXA6115A MPXH6115A SERIES 3–132 Motorola Sensor Device Data www.motorola.com/semiconductors Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Typical Application Circuit (Output Source Current Operation) WIRE BOND STAINLESS STEEL CAP THERMOPLASTIC CASE DIE BOND SEALED VACUUM REFERENCE DIE P1 FLUORO SILICONE GEL DIE COAT LEAD FRAME ABSOLUTE ELEMENT VS Pin 2 +5.0 V GND Pin 3 Vout Pin 4 MPXA6115A to ADC 100 nF 51 K 47 pF MPXH6115A Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). 5.0 4.5 4.0 3.5 3.0 Pressure (ref: to sealed vacuum) in kPa TYP MAX MIN 2.5 2.0 1.5 1.0 0.5 0 Figure 4. Output versus Absolute Pressure TRANSFER FUNCTION: Vout = Vs* (.009*P–.095) ± Error VS = 5.0 Vdc TEMP = 0 to 85 °C Figure 4 shows the sensor output signal relative to pres- sure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXA6115A/MPXH6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor perfor- mance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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