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MPXM2102AS датащи(PDF) 274 Page - Motorola, Inc |
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MPXM2102AS датащи(HTML) 274 Page - Motorola, Inc |
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274 / 670 page ![]() MPX5999D 3–128 Motorola Sensor Device Data www.motorola.com/semiconductors ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pres- sure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 ° to 85 °C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. The performance over temperature is achieved by integrat- ing the shear–stress strain gauge, temperature compensa- tion, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while al- lowing the pressure signal to be transmitted to the silicon dia- phragm. The MPX5999D pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D in- put of a microprocessor or microcontroller. Proper decoup- ling of the power supply is recommended. MAX Figure 2. Output versus Pressure Differential DIFFERENTIAL PRESSURE (kPa) 5.0 4.0 3.0 2.0 0 1100 700 300 0 900 500 4.5 3.5 2.5 1.5 100 TRANSFER FUNCTION: Vout = VS*(0.000901*P+0.04) ± ERROR VS = 5.0 Vdc TEMP = 0 to 85 °C 1.0 0.5 1000 600 200 800 400 MIN TYPICAL SILICONE DIE COAT LEAD FRAME STAINLESS STEEL METAL COVER RTV DIE BOND DIE WIRE BOND Figure 3. Cross–Sectional Diagram (Not to Scale) THERMOPLASTIC CASE P1 P2 Figure 4. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. 1.0 mF IPS 470 pF OUTPUT Vs +5 V 0.01 mF GND Vout Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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