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LM5107 датащи(PDF) 2 Page - National Semiconductor (TI) |
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LM5107 датащи(HTML) 2 Page - National Semiconductor (TI) |
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2 / 10 page ![]() Connection Diagrams Ordering Information Ordering Number Package Type NSC Package Drawing Supplied As LM5107MA SOIC-8 M08A Shipped in anti static rails LM5107MAX SOIC-8 M08A 2500 shipped as Tape & Reel LM5107SD LLP-8 SDC08A 1000 shipped as Tape & Reel LM5107SDX LLP-8 SDC08A 4500 shipped as Tape & Reel Pin Description Pin # Name Description Application Information SO-8 LLP-8 11 V DD Positive gate drive supply Locally decouple to V SS using low ESR/ESL capacitor located as close to IC as possible. 2 2 HI High side control input The LM5107 HI input is compatible with TTL input thresholds. Unused HI input should be tied to ground and not left open 3 3 LI Low side control input The LM5107 LI input is compatible with TTL input thresholds. Unused LI input should be tied to ground and not left open. 44 V SS Ground reference All signals are referenced to this ground. 5 5 LO Low side gate driver output Connect to the gate of the low side N-MOS device. 6 6 HS High side source connection Connect to the negative terminal of the bootstrap capacitor and to the source of the high side N-MOS device. 7 7 HO High side gate driver output Connect to the gate of the low side N-MOS device. 8 8 HB High side gate driver positive supply rail Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal of the bootstrap capacitor to HS. The bootstrap capacitor should be placed as close to IC as possible. Note: For LLP-8 package it is recommended that the exposed pad on the bottom of the LM5107 be soldered to ground plane on the PCB board and the ground plane should extend out from underneath the package to improve heat dissipation. 20130002 20130003 FIGURE 2. www.national.com 2 |
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