IPS0551T

2

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(1) Limited by junction temperature (pulsed current limited also by internal wiring)

(2) Operations at higher switching frequencies is possible. See Appl. Notes.

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters

are referenced to SOURCE lead. (TAmbient = 25

print with 70

µm copper thickness.

Symbol Parameter

Min.

Max.

Units

Test Conditions

Vds

Maximum drain to source voltage

—

37

Vin

Maximum input voltage

-0.3

7

I+in

Maximum IN current

-10

+10

mA

—

2.8

—

35

—

100

Pd

Maximum power dissipation

(1)

—

2

W

ESD1

—

4

C=100pF, R=1500

Ω,

ESD2

—

0.5

C=200pF, R=0

Ω, L=10µH

Tj max.

Max. storage & operating junction temp.

-40

+150

Tlead

Lead temperature (soldering, 10 seconds)

—

300

V

A

kV

Symbol Parameter

Min.

Typ.

Max. Units Test Conditions

Rth 1

Thermal resistance free air

—

60

—

Rth 2

Thermal resistance to PCB min footprint

—

60

—

Rth 3

Thermal resistance to PCB 1" sq. footprint

—

35

—

Rth 4

Thermal resistance junction to case

—

0.7

a

Thermal Characteristics

Recommended Operating Conditions

These values are given for a quick design. For operation outside these conditions, please consult the application notes.

Symbol Parameter

Min.

Max.

Units

Vds (max) Continuous drain to source voltage

—

18

VIH

High level input voltage

4

6

VIL

Low level input voltage

0

0.5

Ids

Continuous drain current

Tamb=85

—

8

—

35

Rin

Recommended resistor in series with IN pin

0.1

0.5

k

Ω

Tr-in (max) Max recommended rise time for IN signal (see fig. 2)

—

1

µS

Max. frequency in short circuit condition (Vcc = 14V)

0

1

kHz

V

A