Pad Description

Pad Name

I/O

Mask Option

Description

PA0~PA7

I/O

Wake-up,

Pull-high

or None

Bidirectional 8-bit I/O port. Each bit can be configured as a wake-up input

by mask option. Software instructions determine the CMOS output or

Schmitt trigger input with or without pull-high resistor (mask option).

PB0~PB7

I/O

Pull-high

or None

Bidirectional 8-bit I/O port. Software instructions determine the CMOS

output or Schmitt trigger input (pull-high resistor depending on mask op-

tion).

PC0~PC7

I/O

Pull-high

or None

Bidirectional 8-bit I/O port. Software instructions determine the CMOS

output or Schmitt trigger input (pull-high resistor depending on mask op-

tion).

GND

¾¾

Negative power supply, ground

VDD

¾¾

Positive power supply

VCC

¾¾

DAC power supply

VSS

¾¾

DAC negative power supply, ground

RES

I

¾

Schmitt trigger reset input, active low

INT

I

Falling Edge Trigger

or Falling/Rising Edge

Trigger

External interrupt Schmitt trigger input with pull-high resistor. Choice fall-

ing edge trigger or falling/rising edge trigger by mask option. Falling edge

triggered active on a high to low transition. Rising edge triggered active

on a low to high transition.

OSC1, OSC2

¾

RC or Crystal

OSC1 and OSC2 are connected to an RC network or a crystal(by mask

option) for the internal system clock. In the case of RC operation, OSC2

is the output terminal for 1/4 system clock.

The system clock may come from the crystal, the two pins cannot be

floating.

AUD0, AUD1

O

¾

Audio output for driving a external transistor or for driving HT82V733

NC

¾¾

No connection

Absolute Maximum Ratings

Supply Voltage ..........................................2.4V to 5.2V

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-20°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT86XXX

Rev. 1.00

9

November 1, 2002