CC3220MODASM2MONR datasheet(8/100 Pages) TI1

8 / 100 page

CC3220MOD, CC3220MODA

SWRS206B – MARCH 2017 – REVISED AUGUST 2017

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Table of Contents

Module Overview

........................................ 1

1.1

Features

.............................................. 1

1.2

Applications

........................................... 2

1.3

Description

............................................ 3

1.4

Functional Block Diagrams

........................... 4

Revision History

......................................... 9

Device Comparison

.................................... 10

3.1

Related Products

.................................... 12

Terminal Configuration and Functions

............ 13

4.1

CC3220MODx and CC3220MODAx Pin Diagram

.. 13

4.2

Pin Attributes

........................................ 15

4.3

Connections for Unused Pins

....................... 17

4.4

Pin Attributes and Pin Multiplexing

.................. 18

4.5

Drive Strength and Reset States for Analog-Digital

Multiplexed Pins

..................................... 32

4.6

Pad State After Application of Power to Chip, but

Before Reset Release

............................... 33

Specifications

........................................... 34

5.1

Absolute Maximum Ratings

......................... 34

5.2

ESD Ratings

........................................ 34

5.3

Recommended Operating Conditions

............... 34

5.4

Current Consumption (CC3220MODS and

CC3220MODAS)

.................................... 35

5.5

Current Consumption (CC3220MODSF and

CC3220MODASF)

................................... 36

5.6

TX Power and IBAT Versus TX Power Level

Settings

.............................................. 37

5.7

Brownout and Blackout Conditions

................. 39

5.8

Electrical Characteristics

............................ 40

5.9

CC3220MODAx Antenna Characteristics

........... 41

5.10

WLAN Receiver Characteristics

.................... 42

5.11

WLAN Transmitter Characteristics

.................. 42

5.12

Reset Requirement

................................. 42

5.13

Thermal Resistance Characteristics for MOB and

MON Packages

..................................... 43

5.14

Timing and Switching Characteristics

............... 43

Detailed Description

................................... 56

6.1

Overview

............................................ 56

6.2

ARM® Cortex®-M4 Processor Core Subsystem

.... 56

6.3

Wi-Fi® Network Processor Subsystem

.............. 57

6.4

Security

.............................................. 59

6.5

Power-Management Subsystem

.................... 62

6.6

Low-Power Operating Mode

........................ 62

6.7

Memory

.............................................. 64

6.8

Restoring Factory Default Configuration

............ 66

6.9

Boot Modes

.......................................... 67

6.10

Device Certification and Qualification

............... 68

6.11

Module Markings

.................................... 71

6.12

End Product Labeling

............................... 72

6.13

Manual Information to the End User

................ 72

Applications, Implementation, and Layout

....... 73

7.1

Typical Application

.................................. 73

7.2

Device Connection and Layout Fundamentals

...... 75

7.3

PCB Layout Guidelines

............................. 76

Environmental Requirements and

Specifications

........................................... 82

8.1

PCB Bending

........................................ 82

8.2

Handling Environment

.............................. 82

8.3

Storage Condition

................................... 82

8.4

Baking Conditions

................................... 82

8.5

Soldering and Reflow Condition

.................... 83

Device and Documentation Support

............... 84

9.1

Third-Party Products Disclaimer

.................... 84

9.2

Development Tools and Software

................... 84

9.3

Firmware Updates

................................... 84

9.4

Device Nomenclature

............................... 85

9.5

Documentation Support

............................. 86

9.6

Trademarks

.......................................... 88

9.7

Electrostatic Discharge Caution

..................... 88

9.8

Export Control Notice

............................... 88

9.9

Glossary

............................................. 88

Mechanical, Packaging, and Orderable

Information

.............................................. 89

10.1

Mechanical, Land, and Solder Paste Drawings

..... 89

10.2

Package Option Addendum

......................... 90

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