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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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A42180-R датащи(PDF) 28 Page - Seoul Semiconductor |
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A42180-R датащи(HTML) 28 Page - Seoul Semiconductor |
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28 / 32 page  Rev. 10 Rev. 10 February. 2011 February. 2011 www.acriche.com www.acriche.com 28 Document No. : SSC-QP-7-07-24 (Rev.00) 3. Reflow Soldering Conditions / Profile 4. Hand Soldering conditions Lead : Not more than 3 seconds @MAX280℃ Slug : Use a thermal-adhesives Pre-heating 200 180 150 0 220 240 260 Rising 5 °C/sec Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (min) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Cooling -5 °C/sec Time [Hr] * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. |
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