LM833 MDC MWC

DUAL AUDIO OPERATIONAL AMPLIFIER

00521854

Die Layout (A - Step)

DIE/WAFER CHARACTERISTICS

Fabrication Attributes

General Die Information

Physical Die Identification

LM833A

Bond Pad Opening Size (min)

110µm x 110µm

Die Step

A

Bond Pad Metalization

ALUMINUM

Physical Attributes

Passivation

VOM NITRIDE

Wafer Diameter

150mm

Back Side Metal

BARE BACK

Dise Size (Drawn)

1219µm x 1270µm

48mils x 50mils

Back Side Connection

Floating

Thickness

406µm Nominal

Min Pitch

288µm Nominal

Special Assembly Requirements:

Note: Actual die size is rounded to the nearest micron.

Die Bond Pad Coordinate Locations (A - Step)

(Referenced to die center, coordinates in µm) NC = No Connection

SIGNAL NAME

PAD# NUMBER

X/Y COORDINATES

PAD SIZE

XYX

Y

OUTPUT A

1

-476

500

110

x

110

INPUT A-

2

-476

-212

110

x

110

INPUT A+

3

-476

-500

110

x

110

VEE-

4

-0

-500

110

x

110

INPUT B+

5

476

-500

110

x

110

INPUT B-

6

476

-212

110

x

110

OUTPUT B

7

476

500

110

x

110

VCC+

8

0

500

110

x

110

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