LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Part No.: LTPL-P033MS28

Page:

9

of

14

BNC-OD-C131/A4

5. Reflow Soldering Characteristics

Time

t

P

Preheat, t

S

t

L

T

Smin

T

Smax

25

T

L

Ramp-dow n

Ramp-up

T

P

Profile Feature

Lead Free Assembly

3°C / second max

150°C

200°C

60 – 180 seconds

217°C

60 – 150 seconds

260°C

5 seconds

Ramp – Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Notes:

1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended

hand soldering condition is 350°C max. and 2secs ma x. for one time only.

2. All temperatures refer to topside of the package, measured on the package body surface.

3. The soldering condition referring to J-STD-020B. If the LEDs were unpacked more than 72hrs,

we

recommend baking the LEDs at 60℃ at least 12 hours before soldering process.

4. The soldering profile could be further referred to different soldering grease material characteristic. The

grease vendor will provide this information.

5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.

6. Although the recommended reflow conditions are specified above, the reflow or hand soldering

condition at the lowest possible temperature is desirable for the LEDs.

7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip

soldering method