BYM11-xxx, RGL41x

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Vishay General Semiconductor

Revision: 11-Dec-13

3

Document Number: 88547

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 3 - Typical Instantaneous Forward Characteristics

Fig. 4 - Typical Reverse Characteristics

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.01

0.1

1

10

Instantaneous Forward Voltage (V)

T

Pulse Width = 300 µs

1 % Duty Cycle

0

20

40

60

80

100

0.01

0.1

1

10

Percent of Rated Peak Reverse Voltage (%)

T

T

1

10

100

1

10

100

Reverse Voltage (V)

T

f = 1.0 MHz

V

0.01

0.1

1

10

100

0.1

1

10

100

Mounted on 0.20" x 0.27" (5 mm x 7 mm)

Copper Pad Areas

t - Pulse Duration (s)

DO-213AB

1

Solderable Ends

D2 = D1

+ 0

- 0.008 (0.20)

D2

0.105 (2.67)

0.095 (2.41)

D1 =

0.022 (0.56)

0.018 (0.46)

0.022 (0.56)

0.018 (0.46)

0.205 (5.2)

0.185 (4.7)

Mounting Pad Layout

0.138 (3.5) MAX.

0.049 (1.25) MIN.

0.238 (6.0) REF.

0.118 (3.0) MIN.