8

DS1165F1

CS7331P

5.2 PCB Land Pattern and Paste Stencil

5.2 PCB Land Pattern and Paste Stencil

The recommended PCB Land Pattern and Paste Stencil Pattern for the CS7331P microphone are shown in Fig. 5-1 and

Fig. 5-2 respectively.

Note that no connection to Pin 4 should be made on the PCB. To avoid accidental connection to Pin 4, it is recommended

to ensure there are no exposed tracks, vias, or copper areas beneath Pin 4.

See also application note WAN0284 General Design Considerations for MEMS Microphones for further details of PCB

footprint design. Full definition of the package dimensions is provided in Section 6.

The recommended PCB Land Pattern is shown in Fig. 5-1.

Figure 5-1. PCB Land Pattern, Top View

The recommended PCB Paste Stencil Pattern is shown in Fig. 5-2.

Figure 5-2. PCB Paste Stencil, Top View