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ADG3247 датащи(PDF) 3 Page - Analog Devices

номер детали ADG3247
подробное описание детали  2.5 V/3.3 V, 16-Bit, 2-Port Level Translating, Bus Switch
PDF  12 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

ADG3247 датащи(HTML) 3 Page - Analog Devices

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PRELIMINARY TECHNICAL DATA
REV. PrD
ADG3247
–3–
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
LFCSP Package
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 32
°C/W
TSSOP Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 98°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the opera tional
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3247 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Table I. Pin Description
Mnemonic
Description
BEx
Bus Enable (Active Low)
SEL
Level Translation Select
Ax
Port A, Inputs or Outputs
Bx
Port B, Inputs or Outputs
Table II. Truth Table
BEx SEL* Function
LL
A = B, 3.3 V to 1.8 V Level Shifting
LH
A = B, 3.3 V to 2.5 V/2.5V to 1.8 V Level Shifting
HX
Disconnect
*SEL = 0 only when VDD = 3.3 V
± 10%
PIN CONFIGURATION
40-Lead LFCSP and 38-Lead TSSOP
PIN 1
INDICATOR
TOP VIEW
ADG3247
1
A6
2
A7
3
A8
4
A9
5
A10
6
A11
7
A12
8
A13
9
A14
10
A15
NC = NO CONNECT
30 B0
29 B1
28 B2
27 B3
26 B4
25 B5
24 B6
23 B7
22 B8
21 B9
TOP VIEW
(Not to Scale)
38
37
36
35
34
33
32
1
2
3
4
5
6
7
SEL
A0
A1
A2
A3
A4
A5
VCC
BE2
BE1
B0
B1
B2
B3
ADG3247
31
30
29
8
9
10
A6
A7
A8
B4
B5
B6
28
27
11
12
A9
A10
B7
B8
26
25
A11
A12
B9
B10
24
23
22
17
A13
A14
A15
B11
B12
B13
21
20
18
19
GND
NC
B14
B15
13
14
15
16
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG3247BCP
–40
°C to +85°CLeaded Chip Scale Package (LFCSP)
CP-40
ADG3247BRU
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-38



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