HT45FM30 datasheet(13/188 Pages) HOLTEK

13 / 188 page

Rev. 1.20

De�e��e� 1�� 201�

Rev. 1.20

De�e��e� 1�� 201�

HT45FM30

Brushless DC Motor Flash MCU

Pad Name

Function

OPT

I/T

O/T

Description

PC2/SCK/SCL/C2X/

PWM2H

PC2

PCPU

CMOS Gene�al pu�pose I/O. Registe� ena�led pull-up

SCK

—

CMOS SPI Se�ial Clo�k

SCL

—

NMOS I2C Clo�k

C2X

CP2C

—

CMOS Co�pa�ato� 2 output

PWM2H

PRM1

PWMC1

—

CMOS PWM output

PC3/SCS/C3X/PWM2L

PC3

PCPU

CMOS Gene�al pu�pose I/O. Registe� ena�led pull-up .

SCS

—

CMOS SPI Slave Sele�t

C3X

CP3C

—

CMOS Co�pa�ato� 3 output

PWM2L

PRM1

PWMC1

—

CMOS PWM output

VDD

—

PWR

—

Positive powe� supply

VSS

—

PWR

—

Negative powe� supply� GND

Note:Thepinsinthetableareforthelargestpackagesize.Asaresultsomepinsonthesmallerpackagesmaynot

exist.

I/T:Inputtype;O/T:Outputtype

OPT:Optionalbyregisteroption

PWR:Power;ST:SchmittTriggerinput

AN:Analoginputpin

CMOS:CMOSoutput

Absolute Maximum Ratings

SupplyVoltage................................................................................................VSS-0.3VtoVSS+6.0V

InputVoltage..................................................................................................VSS-0.3VtoVDD+0.3V

StorageTemperature..................................................................................................-50°Cto150°C

OperatingTemperature................................................................................................-40°Cto85°C

IOHTotal..................................................................................................................................-100mA

IOLTotal................................................................................................................................... 100mA

TotalPowerDissipation........................................................................................................ 500mW

Note:Thesearestressratingsonly.Stressesexceedingtherangespecifiedunder"AbsoluteMaximum

Ratings"maycausesubstantialdamagetothedevice.Functionaloperationofthisdeviceatother

conditionsbeyondthoselistedinthespecificationisnotimpliedandprolongedexposuretoextreme

conditionsmayaffectdevicereliability.

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