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SMM4F12AVCL датащи(PDF) 4 Page - STMicroelectronics |
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SMM4F12AVCL датащи(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() Ordering information scheme SMM4F12AVCL 4/7 Doc ID 022220 Rev 1 2 Ordering information scheme Figure 8. Ordering information scheme Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 7. Thermal resistance junction to ambient versus copper surface under each lead 0.00 0.01 0.10 1.00 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Zth(j-a)/Rth(j-a) t (S) p On recommended pad layout Printed circuit board FR4 copper thickness = 35 µm 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Rth(j-a)(°C/W) S (cm ) CU 2 Printed circuit board FR4 copper thickness = 35 µm SM M 4F 12 A VCL Surface mount Package Surge rating M = STmite package 4F = 400 W in flat package Stand off voltage example - 12 = 12 V Type A = Unidirectional Low clamping voltage |
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