SMCJ datasheet(5/10 Pages) STMICROELECTRONICS

5 / 10 page

SMCJ

Characteristics

Doc ID 5617 Rev 8

5/10

Figure 6.

Junction capacitance versus

reverse applied voltage for

unidirectional types (typical values)

Figure 7.

Junction capacitance versus

reverse applied voltage for

bidirectional types (typical values)

0.01

0.10

1.00

10.00

100

1000

C(nF)

F=1 MHz

OSC=30 mVRMS

j=25 °C

SMCJ5.0A

SMCJ12A

SMCJ24A

SMCJ40A

SMCJ85A

SMCJ188A

VR(V)

0.01

0.10

1.00

10.00

100

1000

C(nF)

F=1 MHz

OSC=30 mVRMS

j=25 °C

SMCJ5.0CA

SMCJ12CA

SMCJ24CA

SMCJ40CA

SMCJ85CA

SMCJ188CA

VR(V)

Figure 8.

Peak forward voltage drop

versus peak forward current

(typical values)

Figure 9.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 10. Thermal resistance junction to

ambient versus copper surface

under each lead

Figure 11. Leakage current versus junction

temperature (typical values)

FM(A)

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

j =25 °C

j =125 °C

VFM(V)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

th(j-a) /Rth(j-a)

tP(s)

Recommended pad layout

PCB FR4, copper thickness = 35 µm

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

th(j-a) (°C/W)

SCU(cm²)

PCB FR4, copper thickness = 35 µm

IR (nA)

1.0E+00

1.0E+01

1.0E+02

1.0E+03

1.0E+04

100

125

150

R=VRM

RM ≥ 10 V

R=VRM

RM <10 V

Tj(°C)

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