| поискавой системы для электроныых деталей |
|
TS8388BVFS датащи(PDF) 44 Page - ATMEL Corporation |
|
|
|||||||||||||||||||||||||||||
TS8388BVFS датащи(HTML) 44 Page - ATMEL Corporation |
|
44 / 57 page ![]() 44 TS8388B 2144C–BDC–04/03 CBGA68 Board Assembly with External Heasink It is recommended to use an external heatsink or PCBoard special design. Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the device. Figure 49. CBGA68 Board Assembly Moisture Characteristics This device is sensitive to the moisture (MSL3 according to JEDEC standard): Shelf life in sealed bag: 12 months at <40 °C and <90% relative humidity (RH). After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temperature 220 °C) must be: • mounted within 198 hours at factory conditions of ≤30°C/60% RH, or •stored at ≤20% RH. Devices require baking, before mounting, if Humidity Indicator Card is >20% when read at 23 °C ±5°C. If baking is required, devices may be baked for: • 192 hours at 40 °C +5°C/-0°C and <5% RH for low-temperature device containers, or • 24 hours at 125 °C ±5°C for high temperature device containers. 31 32.5 Board 50.5 20.2 24.2 |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |