Recommendation on PCB assembly

ESDALC6-4N4

8/11

Doc ID 022191 Rev 2

4

Recommendation on PCB assembly

4.1

Stencil opening design

Reference design

●

Stencil opening thickness: 100 µm

●

Stencil opening for leads: Opening to footprint ratio is 100%.

Figure 17.

Recommended stencil window position

4.2

Solder paste

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste is recommended.

3.

Offers a high tack force to resist component movement during high speed.

4.

Solder paste with fine particles: powder particle size is 20-45 µm.

4.3

Placement

1.

Manual positioning is not recommended.

2.

It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3.

Standard tolerance of ± 0.05 mm is recommended.

180 µm

Footprint

Footprint

T=100 µm and opening

ratio is 100%

580 µm

Stencil window