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STOD03AS датащи(PDF) 16 Page - STMicroelectronics

номер детали STOD03AS
подробное описание детали  Dual DC-DC converter for powering AMOLED displays
PDF  25 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STOD03AS датащи(HTML) 16 Page - STMicroelectronics

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Application information
STOD03AS
16/25
DocID022614 Rev 2
7.2
Recommended PCB layout
The STOD03AS is high frequency power switching device and therefore requires a proper
PCB layout in order to obtain the necessary stability and optimize line/load regulation and
output voltage ripple.
Analog input (VINA) and power input (VINP) must be kept separated and connected together
at the CIN pad only. The input capacitor must be as close as possible to the IC.
In order to minimize the ground noise, a common ground node for power ground and a
different one for analog ground must be used. In the recommended layout, the AGND node
is placed close to CREF ground while the PGND node is centered at CIN ground. They are
connected by a separated layer routing on the bottom through vias.
The exposed pad is connected to AGND through vias.
Figure 14. Top layer and silk-screen (top view, not to scale)



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